Intel patent embeds MicroLEDs in chip packaging — technology may enable embedded optical interconnects through TGVs

Keyword: Photodetector

Publisher: Tom's Hardware UK

Published: Sep 29, 2026

Intel has been granted a U.S. patent that discusses embedding MicroLEDs inside chip packaging, as TrendForce reports. The design embeds semiconductor dies fitted with MicroLEDs directly into a glass … [+5230 chars]

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